1. Fɛn dilannenw (Product Core).
High-Resilience Corrugated Graphite Tape ye baarakɛminɛn ye min dilannen don ni graphite flake saniyalenba ye (saniya ka bon walima a bɛ bɛn 99,9%) ma, ka tɛmɛn a wulicogo fɛ, a dilanni fɛ min bɛ kɛ ni jiri ye, ani a furakɛcogo kɛrɛnkɛrɛnnen ye min bɛ se ka wuli. A nafa jɔnjɔn bɛ "balancing high elasticity rebound and thermal conductivity/sealing properties of graphite", ka grafite laadala fɛnw dimi yɔrɔw ɲɛnabɔ i n’a fɔ brittleness ani poor rebound, ani a bɛnnen don sigili fangama ni funteni jiginni cogoyaw ma minnu bɛ se ka wuli.
2. Fɛɛrɛbɔlanw (paramètres techniques).
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Paramɛtiri Item (Paramɛtiri Item). |
Indicateur Range (Taamaʃyɛnw) yɔrɔ |
Kɔrɔbɔli sariyasun |
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Graphite ka saniya |
A ka bon walima a bɛ bɛn 99,9% ma . |
GB/T 3521-2021 kɔnɔ |
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A ka bon kosɛbɛ |
0,1-5,0mm (a bɛ se ka kɛ ka kɛɲɛ ni mɔgɔw sago ye) |
ISO 4593 ye |
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Large Range (yɔrɔ) min bɛ yen |
5-1000mm (a bɛ se ka kɛ ka kɛɲɛ ni mɔgɔw sago ye) |
ISO 4593 ye |
|
Hakɛ |
1,8-2,1 g/cm3 ye |
GB/T 20495-2021 kɔnɔ |
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Degun hakɛ (2MPa) . |
20%-50% |
ASTM F36 ye |
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Rebound Rate (a jiginnen kɔfɛ) . |
A ka bon walima a bɛ bɛn 85% ma . |
ASTM F36 ye |
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Longitudinal Thermal Conductivity (sɔgɔsɔgɔninjɛ min bɛ kɛ ni funteni ye). |
150-300 W/(m·K) |
ASTM D5470 ye |
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Lateral Thermal Conductivity (Kɛrɛfɛla funteni-kodɔn). |
50-100 W/(m·K) |
ASTM D5470 ye |
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Temperature Resistance Range (Fiɲɛ lamini) . |
-150 degere ~450 degere |
IEC 60068-2-14. Bamako, Mali |
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Tensile (Tensile) fanga |
A ka bon walima a bɛ bɛn 15 MPa ma |
GB/T 1040.4-2006 kɔnɔ |
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Corrosion Resistance (A bɛ kɛ sanga 24 kɔnɔ) . |
Jogoɲumanya bɔnɛ A ka dɔgɔn walima a bɛ bɛn 0,5% ma . |
GB/T 1033.1-2008 kɔnɔ |
3.Fɛn kolomaw
(1)Elasticité ni Rebound baarakɛcogo ɲumanba
O jɔcogo min bɛ kɛ ni jiri ye, o b’a to fɛn dilannen bɛ se ka degun hakɛ sɔrɔ 20%-50% (2MPa tansiyɔn kɔrɔ), ni segin hakɛ ye min ka bon walima min bɛ bɛn 85% ma doni jigin kɔfɛ. A bɛ se ka sigili/suma-yɔrɔ-ko tansiyɔn mara waati jan kɔnɔ, ka a yɛrɛ tanga dɛsɛ ma min bɛ sɔrɔ yɛrɛyɛrɛ fɛ walima funteni bonya ni a sɔgɔli fɛ.
(2)A ka ɲi kosɛbɛ ka funteni minɛ ani ka funteni kunbɛn
Funteni janya janya ye 150-300 W/(m·K) ye, funteni jiginni cɛmancɛ ye 50-100 W/(m·K) ye; funteni kunbɛnni hakɛ -200 degere ~600 degere (yɔrɔ min tɛ baara kɛ), -150 degere ~450 degere (fiɲɛ lamini), o bɛ se ka funteni jiginni jugumanba muɲu.
(3)Kemiki sabatili ani sɔgɔli kunbɛnni
Asidi ni alkali min bɛ se ka kɛlɛ (a hakɛ A ka dɔgɔn walima a bɛ bɛn 30% H2SO4 ma, A ka dɔgɔ walima a bɛ bɛn 20% NaOH ma), a bɛ se ka fɛnɲɛnamafagalanw kɛlɛ (etanɔli, asetɔni, a ɲɔgɔnnaw), a tɛ se ka kɛ ni izinifɛnw fanba ye, min bɛnnen don sigida minnu bɛ fɛnw tiɲɛ i n’a fɔ kemikɛli ni fanga kura iziniw.
(4)A baara nɔgɔya ani a bɛ se ka ladamu
High-Resilience Corrugated Graphite Tape bɛ se ka tigɛ ka kɛɲɛ ni hakɛ o hakɛ ye ka kɛɲɛ ni ɲininiw ye (a bonya ye 5-1000mm ye, a janya ye 0,1-5.0mm ye), a bɛ stamping forming dɛmɛ, wa a bɛnnen don dakunw sigicogo ma minnu tɛ kɛ cogo la walima minnu bɛ kɛ ni funteni ye.
4.Kun kunba
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Aplikasi foro |
Ko Kɛrɛnkɛrɛnnenya la |
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Ɛntɛrinɛti kunnafoniko baarakɛyɔrɔ |
Puce/CPU flexible thermal pad, LED yeelen funteni bɔli interface, 5G base station minɛnw funteni ɲɛnabɔli |
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Enerji Industri kura (Energie Industrie) kura |
Kuwati batiri PACK sirili funteni-minɛnw sirili, fanga mara batiri pake yɔrɔ fani, idɔrɔzi fɛnɲɛnamafagalan bipolar plati sirili |
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Industriw ka sigikafɔ foro |
Valve/flange sigilan min funteni ka bon-, compresseur piston rod sigilan, sigilan flexible pipeline interface la |
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Aerospace Field (Aerospace foro) ye |
Sanfɛla kurunba minnu bɛ funteni caman kɛlɛ, olu bɛ funteni minɛcogo buffer, sateliti minɛnw funteni kɔlɔsili siratigɛ la, gap compensation |
Tags hot .: high-resilience corrugated graphite tape, Sinuwa jamana kasɛti dilannikɛlaw
